JPH0219990Y2 - - Google Patents
Info
- Publication number
- JPH0219990Y2 JPH0219990Y2 JP11762983U JP11762983U JPH0219990Y2 JP H0219990 Y2 JPH0219990 Y2 JP H0219990Y2 JP 11762983 U JP11762983 U JP 11762983U JP 11762983 U JP11762983 U JP 11762983U JP H0219990 Y2 JPH0219990 Y2 JP H0219990Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- main
- spring
- main printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 1
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11762983U JPS6025169U (ja) | 1983-07-28 | 1983-07-28 | 着脱用積層プリント基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11762983U JPS6025169U (ja) | 1983-07-28 | 1983-07-28 | 着脱用積層プリント基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6025169U JPS6025169U (ja) | 1985-02-20 |
JPH0219990Y2 true JPH0219990Y2 (en]) | 1990-05-31 |
Family
ID=30270698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11762983U Granted JPS6025169U (ja) | 1983-07-28 | 1983-07-28 | 着脱用積層プリント基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6025169U (en]) |
-
1983
- 1983-07-28 JP JP11762983U patent/JPS6025169U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6025169U (ja) | 1985-02-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH036626B2 (en]) | ||
US7200011B2 (en) | Thermal interface adapter plate conversion kit and method | |
JPH0951182A (ja) | 部品の取付装置 | |
JPH0219990Y2 (en]) | ||
CN211090145U (zh) | 电路板及电子设备 | |
JP2592361B2 (ja) | プリント配線板 | |
JPH0737360Y2 (ja) | 集積回路部品 | |
JPH05315721A (ja) | プリント配線板およびそのコネクタ | |
JPH02106087A (ja) | 混成集積回路装置 | |
JPS6236359Y2 (en]) | ||
JP2569114Y2 (ja) | 基板と端子との取付構造 | |
JP4147436B2 (ja) | ヒートシンクを挟んだ基板の接続方法と装置 | |
JP2000183243A (ja) | 変換モジュール | |
JPH0510388Y2 (en]) | ||
EP1399006A2 (en) | A mounting structure of a wireless module | |
JP3404275B2 (ja) | 複数基板からなるモジュール及びその製造方法 | |
JPS61276287A (ja) | 電子機器の組み立て方法 | |
JPH0726861Y2 (ja) | 混成集積回路基板モジュール | |
JPS626713Y2 (en]) | ||
JP2976916B2 (ja) | Jリードic用ソケット | |
JPH0628814Y2 (ja) | アンテナ取付装置 | |
JPH07120840B2 (ja) | 印刷配線基板 | |
JPH03215966A (ja) | 電力用トランジスタ取付装置 | |
JPH05135834A (ja) | 基板間接続コネクタ | |
JPH04249078A (ja) | 印刷配線板の接続端子装置 |